Registration Fees

Electron Microscopy Workshop Registration Fees

 

The following fees are for the Electron Microscopy Workshop held at Univ of Wollongong, Batu Kawan, Penang on the 7th to 11th of Sept.

 

Please note all information collected in this form is for the purpose of facilitating the organizing of this event and will not be used for any other purposes or shared with parties outside the organizing committee.

 

Attendance Fees: RM200

 

The fee for this event covers the cost for all sessions on 7 and 8th Sept of the event and includes two lunches and morning and afternoon tea.

 

Electron Microscopy Sample Analysis Fees

 

RM200 per session (1 hour)

 

We are looking for sponsors for school students to participate in this event to expose them to the high-tech world of micro analysis. If your company sponsors this event, up to 5 of your company's staff can participate for free, depending on the level of sponsorship.

 

Amount of Sponsorship	Free Attendance	Sample Analysis Session
RM1000	1 pax	1 Session (1 hour)
RM3000	3 pax	2 sessions (2 hours)
RM5000	5 pax	3 sessions (3 hours)

This training is conducted by HRDF Accredited trainers, so it is HRDF claimable.

 

Program & Speakers

7th Sept
08:00	Pickup
08:45	Arrive
09:00 am	Opening
	Attend Talk 1 (Intro to Electron Microscopy)   and Talk 2 (Intro to Surface Beam Analysis)
11:00	Group 1: Campus Tour    Group 2:Short Talk & Demo of Electron Microscope
11:30	Group 2: Campus Tour    Group 1:Demo of Electron Microscope
12:00	Depart
13:00	Pickup
13:45	Arrive
14:00	Group 1: Campus Tour    Group 2:Short Talk & Demo of Electron Microscope
15:00	Group 2: Campus Tour    Group 1:Demo of Electron Microscope
16:00	Depart

 

8th Sept
09:00	Pick up
09:45	Arrive
10:00 am	Group 1: Talk on Studying in UoW / Campus Tour    Group 2: Short Talk & Demo of Electron Microscope
11:00	Group 1: Talk on Studying in UoW / Campus Tour    Group 2:Short Talk & Demo of Electron Microscope
12:00	Depart
13:00	Pick up
13:45	Arrive
14:00	Group 1: Campus Tour    Group 2:Short Talk & Demo of Electron Microscope
15:00	Group 2: Campus Tour    Group 1: Short Talk & Demo of Electron Microscope
16:00	Depart

 

9th - 11th Sept
09:00	Pick up
09:45	Arrive
10:00 am	Group 1: Talk on Studying in UoW / Campus Tour    Group 2:Demo of Electron Microscope
11:00	Group 1: Talk on Studying in UoW / Campus Tour    Group 2:Short Talk & Demo of Electron Microscope
12:00	Depart

 

 

 

 

Dr. Yeoh Lai Seng Catching the Invisible: The Microchip Detective's Guide to Failure Analysis

 

Biography

 

Dr. Yeoh Lai Seng is currently a Lead Principal Engineer in the Failure Analysis Department at Infineon Technologies Memory Solutions Malaysia Sdn. Bhd., where he has been serving since 2010. As a technical lead, he manages a team of engineers supporting the memory product division, with expertise spanning Flash Memory, FRAM, RRAM, SRAM, HyperRAM, eCT memory, and SONOS memory. 

 

Dr. Yeoh Lai Seng is currently a Lead Principal Engineer in the Failure Analysis Department at Infineon Technologies Memory Solutions Malaysia Sdn. Bhd., where he has been serving since 2010. As a technical lead, he manages a team of engineers supporting the memory product division, with expertise spanning Flash Memory, FRAM, RRAM, SRAM, HyperRAM, eCT memory, and SONOS memory. 

 

He holds a Bachelor in Applied Physics from USM (2001), first Master in Solid State Physics from USM (2004), second Master in Microelectronics Engineering from MMU (2011), and a Ph.D. in Semiconductor (GaN-based MOSFET) from USM (2014). 

 

He holds a Bachelor in Applied Physics from USM (2001), first Master in Solid State Physics from USM (2004), second Master in Microelectronics Engineering from MMU (2011), and a Ph.D. in Semiconductor (GaN-based MOSFET) from USM (2014). 

 

Title
Catching the Invisible: The Microchip Detective's Guide to Failure Analysis 

Abstract

 

This presentation explores the critical field of semiconductor failure analysis (FA) and its evolution into a strategic driver of "yield maturity" in modern memory manufacturing. As memory devices shrink to nanometer dimensions, physical defects—such as micro cracks, corrosion, and metallic contaminants— become increasingly invisible to conventional inspection methods, threatening both production yield and long term reliability. Drawing on real industrial case studies from Flash memory, flip flop circuits, and advanced packaging, this session introduces cutting edge diagnostic techniques including nano probing, Electron Beam Absorbed/Induced Current (EBAC/EBIC), high resolution STEM imaging, and advanced Energy Dispersive X ray (EDX) spectroscopy. Attendees will learn how these powerful tools not only shorten analysis turnaround time from days to hours, but also uncover root causes—such as tungsten particles from CMP residues and cobalt stringers from silicidation processes—that lead to measurable yield improvements of up to 4% and >60% reduction in defect rates for automotive applications. The webinar also addresses the emerging challenges posed by 3D packaging technologies like Through Silicon Vias (TSVs) and hybrid bonding, and looks ahead at future enablers such as Plasma FIB and machine learning assisted defect classification. This session bridges fundamental semiconductor physics with industrial manufacturing reality, demonstrating why failure analysis is the unsung hero behind every reliable smartphone, computer, and automotive electronic system. 

 

 

Dr. Azdiar A. Gazder Multiscale Analytical Microscopy

 
 
Biography

Dr. Azdiar A. Gazder is a Senior Research Fellow at the Electron Microscopy Centre (EMC), Australian Institute for Innovative Materials (AIIM), University of Wollongong, Australia, where he specialises in advanced electron microscopy and materials characterisation. He obtained his Graduate Diploma and PhD in Materials Engineering from Monash University and has since established an international reputation in microstructural characterisation, crystallography, and physical metallurgy. He played a leading role in the development of the University of Wollongong Electron Microscopy Centre, one of Australia's premier facilities for advanced microscopy research.

 
Dr. Gazder's research focuses on understanding the relationships between material processing, microstructure, and performance through advanced characterisation techniques, particularly scanning electron microscopy (SEM), electron backscatter diffraction (EBSD), and diffraction-based analysis. His work has contributed to the development of advanced structural materials, including steels, aluminium, titanium, magnesium, and shape-memory alloys, supporting innovations in manufacturing, energy, and engineering applications.
 

An internationally recognised researcher, Dr. Gazder has authored more than 120 peer-reviewed publications, secured numerous competitive research grants, and collaborated extensively with industry and research institutions. He is a Certified Materials Professional (CMP), a Fellow of the Royal Microscopical Society (FRMS), and serves as an Executive Member of the Australian Microbeam Analysis Society (AMAS). His keynote address will provide valuable insights into the latest developments in electron microscopy and demonstrate how advanced characterisation techniques are driving innovation in materials science and engineering.