Welcome to the Seeing the Unseen: Exploring the World of Microscopy and Beam Surface Analysis Workshop 2026 event page! 

Mark your calendar for the 7 - 11th September 2026 - Seeing the Unseen: Exploring the World of Microscopy and Beam Surface Analysis Workshop 2026 is going to rock Penang. 

 

Seeing the Unseen:  

Exploring the World of Electron Microscopy and Surface Beam Analysis. 

 

University of Wollongong, Batu Kawan Campus, Batu Kawan, Penang. 

7th – 11th Sept, 2026 

  

This workshop is designed to equip your engineers and technicians with the fundamentals of electron microscopy and particle beam methods for advanced material analysis and sample preparation. Stay ahead of industry standards, sharpen your team's technical edge, and discover how these cutting-edge methods can directly solve your company’s quality control challenges. 

 

In this workshop, participants will explore the inner workings of electron microscopes and the various techniques that maximize data collection for problem solving. You will get to know the latest instrumentations and frontier technologies in this area. Additionally, you are invited to bring your own samples for on-site analysis using the Hitachi SU3800 IPT VP-SEM. Take this unique opportunity to have your materials evaluated by experts with decades of experience from Hi-Tech Instruments, receive tailored advice, and engage in meaningful discussions with other professionals practicing in the field.

 

Seeing the Unseen: Exploring the World of Microscopy and Beam Surface Analysis Workshop 2026 registration is now open!

Objectives:
* Latest science and guidelines
* Expert-led talks and hands-on sessions
* Regional and international perspectives
* Networking with leaders in electron microscopy and technology

 

Hitachi SU3800 VP-SEM for  High-Performance Microanalysis 

 

The SU3800 in action: 

 

Hitachi SU3800

 

Features: 

 

  • Zero-Preparation Imaging: Variable pressure mode enables quick observation of non-conductive and biological specimens.  

  • Intelligent Automation: Features Intelligent Filament Technology (IFT) for 3x longer filament life and auto-adjustments for rapid data acquisition.  

  • Seamless Navigation: Integrated camera system (SEM MAP) allows smooth tracking across the entire sample area.  

  


 

Participation Details 

RM200 : Covering Talks, Demonstration of the Hitachi SU3800 IPT VP-SEM,  

   Campus Tour and Lunch on 7th and 8th Sept   

 

RM300 per session :  

For 1 session of sample analysis ( 2 – 3 hours) using the Hitachi SU3800 IPT VP-SEM  

There shall be 5 sessions.  You can book more than 1 session.    

For sessions time – see attached schedule.  

 

In conjunction with this workshop, we have planned to bring school and university students to expose them to the world of micro-analysis as part of the of the STEM promotion initiative among schools. We would be grateful if your company can sponsor to cover the expenses related to the cost bringing the students on campus to experience the working of technology .  

All sponsors will have their company or names on public materials disseminated related to the Workshop-  flyers, programs, banners and relevant projected visuals.  

Amount of sponsorship 

Free Attendance   

Free Sample Analysis  

RM1000 

 1 pax 

1 session ( 1 hours)  

RM3000 

3 pax 

2 sessions (2 hours)  

RM5000 

5 pax 

3 sessions ( 3 hours)  

 

 


 


For more information and registration, please do visit the Howei platform HERE, Facebook page HERE or email us at helpdesk@howei.com

Registration Fees

Electron Microscopy Workshop Registration Fees

 

The following fees are for the Electron Microscopy Workshop held at Univ of Wollongong, Batu Kawan, Penang on the 7th to 11th of Sept.

 

Please note all information collected in this form is for the purpose of facilitating the organizing of this event and will not be used for any other purposes or shared with parties outside the organizing committee.

 

Attendance Fees: RM200

 

The fee for this event covers the cost for all sessions on 7 and 8th Sept of the event and includes two lunches and morning and afternoon tea.

 

Electron Microscopy Sample Analysis Fees

 

RM200 per session (1 hour)

 

We are looking for sponsors for school students to participate in this event to expose them to the high-tech world of micro analysis. If your company sponsors this event, up to 5 of your company's staff can participate for free, depending on the level of sponsorship.

 

Amount of Sponsorship Free Attendance Sample Analysis Session
RM1000 1 pax 1 Session (1 hour)
RM3000 3 pax 2 sessions (2 hours)
RM5000 5 pax 3 sessions (3 hours)

This training is conducted by HRDF Accredited trainers, so it is HRDF claimable.

Program & Speakers

Sept 7 

09:00   

Opening  

09:30 

SEM Technologies for Surface Morphology to Atomic-scale Characterisation 

Mr KY Tay ( Managing Director, Hi-Tech Instruments)  

10:10 

Introduction to Beam Analytical Technics  

Dr  YL Khong (MD, POWERSAINS, Adjunct Professor, Univ of Wollongong)  

10:50  

Break  

11:10 

TOF-SIMS Surface Characterization of Top Monolayers 

Dr Abby  Soo  (Technical Specialist, Hi-Tech Instruments) 

11:50  

Campus Tour 

12:00 

Lunch

13:00  

  • Demonstration of Instrumentation             

  • Sample Analysis Session 1 

16:00 

Sample Analysis Session 1 end 

Sept 8 

09:00   

Applied Electron Microscopy for Industry  

Dr. Yeoh Lai Seng (Lead Principal Engineer, Failure Analysis)      

09:45 

Signals to Decisions: Utilizing Surface Beam Analysis in Industrial Manufacturing 

Dr BC Kang (Sr, Manager, Western Digital, Penang)   

10:30 

Break  

11:00  

Electron Microscopy for Materials Research   

Dr. Azdiar A. Gazder (Senior Research Fellow & FEGSEM/EBSD Supervisor, Electron Microscopy Centre (EMC), Australian Institute for Innovative Materials (AIIM), University of Wollongong, Australia                                                                             

11:45 

Campus Tour 

12:30 

Lunch 

13:00  

  • Demonstration of Instrumentation  

  • Sample Analysis Session 2 

16:00 

  • Sample Analysis Sessions 2 end 

Sept 9,10,11 

 

10:00 

  • Demonstration of Instrumentation  

  • Sample Analysis Session 3 (July 9), Session 4(July 10), Session 5 (July11) 

 

12:00 

  • Sample Analysis Sessions 3  (July 9) , Session 4(July 10), Session 5 (July11) ends 

 

14:00 

  • Demonstration of Instrumentation  

  • Sample Analysis Session 3 (July 9),  Session 4(July 10), Session 5 (July11) 

 

16:00 

  • Sample Analysis Sessions 3 (Jul 9),  Session 4(July 10), Session 5 (July11) ends 

 

 

 

 

  Dr. Khong Yoon Loong  
 

Biography

Dr. Khong holds a PhD in Solid State Physics. His distinguished career spans executive leadership roles across semiconductor manufacturing, data storage technology, microprocessor assembly, and the solar energy sector, alongside extensive contributions to academia as a university professor and faculty dean. A veteran organizer, he was instrumental in the greenfield startup of two manufacturing facilities and two private universities. Prior to founding PowerSains, he served as the CEO of Tech Dome Penang, playing a pivotal role in the inception, launch, and strategic growth of the world-class science center. In recognition of his foundational contributions to STEM promotion, he was conferred the Darjah Johan Negeri (DJN) by the Penang State Government in 2018.

 
     

 

Dr. Yeoh Lai Seng

Catching the Invisible: The Microchip Detective's Guide to Failure Analysis 

 
 

Biography

Dr. Yeoh Lai Seng is currently a Lead Principal Engineer in the Failure Analysis Department at Infineon Technologies Memory Solutions Malaysia Sdn. Bhd., where he has been serving since 2010. As a technical lead, he manages a team of engineers supporting the memory product division, with expertise spanning Flash Memory, FRAM, RRAM, SRAM, HyperRAM, eCT memory, and SONOS memory. 

 

Dr. Yeoh Lai Seng is currently a Lead Principal Engineer in the Failure Analysis Department at Infineon Technologies Memory Solutions Malaysia Sdn. Bhd., where he has been serving since 2010. As a technical lead, he manages a team of engineers supporting the memory product division, with expertise spanning Flash Memory, FRAM, RRAM, SRAM, HyperRAM, eCT memory, and SONOS memory. 

 

He holds a Bachelor in Applied Physics from USM (2001), first Master in Solid State Physics from USM (2004), second Master in Microelectronics Engineering from MMU (2011), and a Ph.D. in Semiconductor (GaN-based MOSFET) from USM (2014). 

 

He holds a Bachelor in Applied Physics from USM (2001), first Master in Solid State Physics from USM (2004), second Master in Microelectronics Engineering from MMU (2011), and a Ph.D. in Semiconductor (GaN-based MOSFET) from USM (2014). 

 
  Title
Catching the Invisible: The Microchip Detective's Guide to Failure Analysis 
 
 

Abstract

 

This presentation explores the critical field of semiconductor failure analysis (FA) and its evolution into a strategic driver of "yield maturity" in modern memory manufacturing. As memory devices shrink to nanometer dimensions, physical defects—such as micro cracks, corrosion, and metallic contaminants— become increasingly invisible to conventional inspection methods, threatening both production yield and long term reliability. Drawing on real industrial case studies from Flash memory, flip flop circuits, and advanced packaging, this session introduces cutting edge diagnostic techniques including nano probing, Electron Beam Absorbed/Induced Current (EBAC/EBIC), high resolution STEM imaging, and advanced Energy Dispersive X ray (EDX) spectroscopy. Attendees will learn how these powerful tools not only shorten analysis turnaround time from days to hours, but also uncover root causes—such as tungsten particles from CMP residues and cobalt stringers from silicidation processes—that lead to measurable yield improvements of up to 4% and >60% reduction in defect rates for automotive applications. The webinar also addresses the emerging challenges posed by 3D packaging technologies like Through Silicon Vias (TSVs) and hybrid bonding, and looks ahead at future enablers such as Plasma FIB and machine learning assisted defect classification. This session bridges fundamental semiconductor physics with industrial manufacturing reality, demonstrating why failure analysis is the unsung hero behind every reliable smartphone, computer, and automotive electronic system. 

 

 

 


 

 

 

Dr. Azdiar A. Gazder

Multiscale Analytical Microscopy

 

Biography


Dr. Azdiar A. Gazder is a Senior Research Fellow at the Electron Microscopy Centre (EMC), Australian Institute for Innovative Materials (AIIM), University of Wollongong, Australia, where he specialises in advanced electron microscopy and materials characterisation. He obtained his Graduate Diploma and PhD in Materials Engineering from Monash University and has since established an international reputation in microstructural characterisation, crystallography, and physical metallurgy. He played a leading role in the development of the University of Wollongong Electron Microscopy Centre, one of Australia's premier facilities for advanced microscopy research.


 
Dr. Gazder's research focuses on understanding the relationships between material processing, microstructure, and performance through advanced characterisation techniques, particularly scanning electron microscopy (SEM), electron backscatter diffraction (EBSD), and diffraction-based analysis. His work has contributed to the development of advanced structural materials, including steels, aluminium, titanium, magnesium, and shape-memory alloys, supporting innovations in manufacturing, energy, and engineering applications.
 


An internationally recognised researcher, Dr. Gazder has authored more than 120 peer-reviewed publications, secured numerous competitive research grants, and collaborated extensively with industry and research institutions. He is a Certified Materials Professional (CMP), a Fellow of the Royal Microscopical Society (FRMS), and serves as an Executive Member of the Australian Microbeam Analysis Society (AMAS). His keynote address will provide valuable insights into the latest developments in electron microscopy and demonstrate how advanced characterisation techniques are driving innovation in materials science and engineering.

 
     
     


 

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